| Backplane |
The medium used to interconnect a number of
circuit boards. Typically refers to a special, heavy-duty printed or discrete wired
circuit board.
|
| a |
| Ball Grid Array (BGA) |
A packaging technology similar to a pad
grid array, in which a device's external connections are arranged as an array of
conducting pads on the base of the package. However, in the case of a ball grid array,
small balls of solder are attached to the conducting pads.
|
| a |
| Bare Die |
An unpackaged integrated circuit.
|
| a |
| Barrier Layer (see Overglassing) |
| a |
| Base |
Refers to the number of digits in a
numbering system. For example, the decimal numbering system is said to be base-10. May
also be referred to as the "radix".
|
| a |
| Basic
Cell |
A pre-defined group of unconnected
components that is replicated across the surface of a gate array.
|
| a |
| BDD (Binary Decision Diagram) |
A method of representing Boolean equations as decision trees.
|
| a |
| Bebop |
| Bi-quinary |
A system which utilizes two bases, base-2
and base-5, to represent decimal numbers. Each decimal digit is represented by the sum of
two parts, one of which has the value of decimal zero or five, and the other the values of
zero through four. The abacus is one practical example of the use of a bi-quinary system.
|
| a |
| BIST (Built-In
Self-Test) |
A test strategy in which additional logic is built into a component,
thereby allowing it to test itself.
|
| a |
| Bit |
Abbreviation of binary digit.
|
| a |
| BJT (Bipolar Junction
Transistor) |
A family of transistors.
|
| a |
| Blind Via |
A via that is only visible from one side of
the substrate.
|
| a |
| Bobble |
A small circle used on the inputs to a
logic gate symbol to indicate an active-low input or control, or on the outputs to
indicate a negation (inversion) or a complementary signal. Some engineers prefer to use
the term bubble.
|
| a |
| Boolean Algebra |
A mathematical way of representing logical
expressions.
|
| a |
| Boot-Strapping |
A sequence of initialization operations
performed by a computer when it is first powered up.
|
| a |
| Bounce Pad |
A special pattern etched onto the power or
ground plane of a microwire circuit board to be used in conjunction with a laser beam
which is employed to create blind vias. The laser beam evaporates the epoxy forming the
outer layers of the board and continues down to the bounce pad which reflects, or bounces,
it back up, thereby terminating the via.
|
| a |
| Braze |
To unite or fuse two pieces of metal by
heating, or with a hard solder with a high melting point.
|
| a |
| Built-In Self-Test (BIST) |
A test strategy in which additional logic
is built into a component, thereby allowing it to test itself.
|
| a |
| Bulk Storage |
Refers to some form of media, typically
magnetic, such as tape or a disk drive which can be used to store large quantities of
information relatively inexpensively.
|
| a |
| Buried Via |
A via used to link conducting layers
internal to a substrate. Such a via is not visible from either side of the substrate.
|
| a |
| Bus |
