| Octal |
Base-8 numbering system. Each octal digit can
be directly mapped onto three binary digits, or bits.
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| Ohm |
Unit of resistance. The Greek letter omega, *,
is often used to represent ohms; for example, 1M* indicates one million ohms.
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| One-Hot Encoding |
A form of state assignment
for state machines in which each state is represented by an individual state variable.
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| One-Time Programmable |
A device such as a PAL, PLA, or PROM that can
only be programmed a single time and whose contents cannot be subsequently erased.
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| Operating System |
The collective name for the set of master
programs that control the core operation and the base-level user-interface of a computer.
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| Optical Interconnect |
The generic name for interconnection
strategies based on opto-electronic systems, including fiber-optics, free-space,
guided-wave, and holographic techniques.
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| Optical Lithography |
A process in which radiation at optical
wavelengths (usually in the ultraviolet range) is passed through a mask, and the resulting
patterns are projected onto a layer of resist coating the substrate material.
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| Optical
Mask |
A sheet of material carrying patterns that are
either transparent or opaque to the wavelengths used in an optical-lithographic process.
Such a mask can carry hundreds of thousands of fine lines and geometric shapes.
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| Opto-Electronic |
Refers to a system which combines optical and
electronic components.
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| Organic Resist |
A material which is used to coat a substrate
and is then selectively cured to form an impervious layer. These materials are called
organic because they are based on carbon compounds as are living creatures.
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| Organic Solvent |
A solvent for organic materials such as those
used to form organic resists.
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| Organic Substrate |
Substrate materials such as FR4, in which woven
glass fibers are bonded together with an epoxy. These materials are called organic because
epoxies are based on carbon compounds as are living creatures.
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| Overglassing |
One of the final stages in the integrated
circuit fabrication process in which the entire surface of the wafer is coated with a
layer of silicon dioxide or silicon nitride. This layer may also be referred to as the
barrier layer or the passivation layer. An additional lithographic step is required to
pattern holes in this layer to allow connections to be made to the pads.
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