| TAB (Tape Automated Bonding) |
A
process in which transparent flexible tape has tracks created on its surface. The pads on
unpackaged integrated circuits are attached to corresponding pads on the tape which is
then stored in a reel. Silver-loaded epoxy is screen printed on the substrate at the site
where the device is to be located and onto the pads to which the device's leads are to be
connected. The reel of TAB tape is fed through an automatic machine which pushes the
device and the TAB leads into the epoxy. When the silver-loaded epoxy is cured using
reflow soldering or vapor-phase soldering, it forms electrical connections between the TAB
leads and the pads on the substrate.
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| a |
| Tap |
A register output which is used to generate
the next data input to a linear feedback shift register.
|
| a |
| Tape Automated Bonding (TAB) |
A process in which transparent flexible tape
has tracks created on its surface. The pads on unpackaged integrated circuits are attached
to corresponding pads on the tape which is then stored in a reel. Silver-loaded epoxy is
screen printed on the substrate at the site where the device is to be located and onto the
pads to which the device's leads are to be connected. The reel of TAB tape is fed through
an automatic machine which pushes the device and the TAB leads into the epoxy. When the
silver-loaded epoxy is cured using reflow soldering or vapor-phase soldering, it forms
electrical connections between the TAB leads and the pads on the substrate.
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| a |
| Tera |
Unit qualifier (symbol = T) representing one
million million, or 1012. For example, 3THz stands for
3 x 1012 Hertz
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| a |
| Tertiary Logic |
An experimental technology in which logic gates are based on
three distinct voltage levels. The three voltages are used to represent the tertiary
digits 0, 1, and 2, and their logical equivalents FALSE, TRUE, and MAYBE.
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| a |
| Thermal Relief Pad |
A special pattern etched around a via or a
plated through-hole to connect it into a power or ground plane. A thermal relief pad is
necessary to prevent too much heat being absorbed into the power or ground plane when the
board is being soldered.
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| a |
| Thermal Tracking |
Typically used to refer to the problems associated with optical
interconnection systems whose alignment may be disturbed by changes in temperature.
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| a |
| Thick-Film Process |
A process used in the manufacture of hybrids
and, to a lesser extent, multichip modules in which signal and dielectric (insulating)
layers are screen-printed onto the substrate.
|
| a |
| Thin-Film Process |
A process used in the manufacture of hybrids
and multichip modules in which signal layers and dielectric (insulating) layers are
created using opto-lithographic techniques.
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| a |
| Through-Hole (see Lead Through-Hole, Plated Through-Hole, and Through-Hole
Via) |
| a |
| Through-Hole Via |
A via that passes all the way through the
substrate.
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| a |
| Thru-Hole |
A commonly used abbreviation of
"through-hole".
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| a |
| Time-Of-Flight |
The time taken for a signal to propagate from
one logic gate or opto-electronic component to another.
|
| a |
| Tin-Lead Plating |
An electroless plating process in which
exposed areas of copper on a circuit board are coated with a layer of tin-lead alloy. The
alloy is used to prevent the copper from oxidizing and provides protection against
contamination.
|
| a |
| Tinning |
An abbreviation of tin-lead plating, which is an electroless plating process in which exposed areas of
copper on a circuit board are coated with a layer of tin-lead alloy. The alloy is used to
prevent the copper from oxidizing and provides protection against contamination.
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| a |
| Toggle |
Refers to the contents or outputs of a logic
function switching to the inverse of their previous logic values.
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| a |
| Trace |
A
conducting connection between electronic components. May also be called a track
or a signal. In the case of integrated circuits, such interconnections are often
referred to collectively as metalization.
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| a |
| Tracks |
A conducting connection between electronic
components. May also be called a trace or a signal. In the case of
integrated circuits, such interconnections are often referred to collectively as
metalization.
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| a |
| Transducer |
A device that converts input energy of one
form into output energy of another.
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| a |
| Transistor |
A three-terminal semiconductor device that, in
the digital world, can be considered to operate like a switch.
|
| a |
| Tri-State Function |
A function whose output can adopt three
states: 0, 1, and Z (high-impedance) The function does not drive any value in the Z state
and, in many respects, may be considered to be disconnected from the rest of the circuit.
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to return to the main glossary.
